This project is co-funded by the European Union

News & Events

Press Release & Articles

LOCOMACHS featured in Clean Sky's Skyline magazine

Maria Weiland was invited to present LOCOMACHS in the March edition 2016 (n°18) of Clean Sky's Skyline magazine. The article can be found on page 9.


Variation Simulation During Assembly of Non-rigid Components. Realistic Assembly Simulation with ANATOLEFLEX Software
14th CIRP CAT 2016 - CIRP Conference on Computer Aided Tolerancing

News & Events

3rd EASN workshop on Aerostructures

Location: Milan, Italy | Duration: 3 days

During the 3rd EASN workshop on Aerostructures in Milan, 9-11th October, 2013, Luca Bottero, from LOCOMACHS partner Alenia Aermacchi, will give a talk entitled “LOw COst Manufacturing and Assembly of Composite and Hybrid Structures (LOCOMACHS): An overview Presentation”.

In the frame of EASN knowledge and innovation dissemination activities, the 3rd workshop organized by the EASN Association aims to offer the Aeronautics community a forum to present and discuss the latest advances in the wider area of Aerostructures, to give an updated state of the art of the research in Aerostuctures in Europe and to present new ideas and innovative concepts for future research and projects.

The Workshop follows the 1st EASN Workshop on Aerostructures (Paris, 2010) and the 2nd EASN Workshop on Flight Physics and Propulsion (Prague, 2012), both successful events where a large number of attendees from academy and industry discussed latest achievements, including more than 90% of the EC funded projects running at that time on the respective technological fields.

The Workshop is co-organized by Politecnico di Milano which is the largest technical University in Italy with renowned laboratories where many research activities in the field are on course and the EASN Association. It will take place on the 9th -11th of October 2013 in the Bovisa Campus, Politecnico di Milano.

Updated information about the workshop can be found at the  3rd EASN International Workshop website.